As the global economy mends, the 2021 growth of Wire Bonding Equipment will have significant change from previous year. According to our (LP Information) latest study, the global Wire Bonding Equipment market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Wire Bonding Equipment market size will reach USD million in 2028, growing at a CAGR of % over the analysis period.
The United States Wire Bonding Equipment market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Wire Bonding Equipment market, reaching US$ million by the year 2028. As for the Europe Wire Bonding Equipment landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Wire Bonding Equipment players cover Kulicke & Soffa (K&S), ASM Pacific Technology, TPT, and Hesse Mechatronics, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Wire Bonding Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Manual Wire Bonding Equipment
Semi-Automatic Wire Bonding Equipment
Fully-Automatic Wire Bonding Equipment
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Kulicke & Soffa (K&S)
ASM Pacific Technology
TPT
Hesse Mechatronics
West Bond
Hybond
KAIJO Corporation
Questar Products
Anza Technology
F&K Delvotec Bondtechnik
Shinkawa
Palomar Technologies
Micro Point Pro Ltd (MPP)
Planar Corporation
Mech-El Industries Inc.
Ultrasonic Engineering